Hybrid Wire-Arc Additive Manufacturing of Topology Optimized Aviation Components [PDF]
Hybrid Wire-Arc Additive Manufacturing of Topology Optimized Aviation Components [PDF]
Hybrid Wire-Arc Additive Manufacturing of Topology Optimized Aviation Components [PDF]
The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
Exhibitor Before After Hours Exhibit Space Function Request Form [PDF]
RAPID + TCT Digital Guest Pass
RAPID + TCT 22 Enhanced Digital Booth [PDF]
RAPID + TCT Shuttle Bus Schedule
Annual Chapter Recognition Winners
Changing the Face(s) of Manufacturing
Personalized Manufacturing: Psychology and Sociology as Fundamental Design Elements in Future Advanced Production Systems