Past Recipients-AOM.pdf
The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
Outstanding Young Manufacturing Engineer Award Past Recipients
SME College of Fellows Previous Winners
Outstanding Young Manufacturing Engineer Award Recipients
Awards Submission Instructions
On-site Additive Manufacturing of Water Filtration and Decontamination Devices
Next-Generation Materials: Government presented by Hilmar Koerner, AFRL, at Aerospace Composites Forum on July 19, 2022.
Low Cost Agile Manufacturing presented by Ray Fisher, AFRL, at Aerospace Composites Forum on July 19, 2022.