The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
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David Dornfeld Manufacturing Vision Award 2021 Runner-Up
David Dornfeld Manufacturing Vision Award 2021 Finalist
David Dornfeld Manufacturing Vision Award 2021 Finalist